This
material is a newly developed high-tech synthetic material with soft texture,
low density, high strength, high modulus, and high temperature resistance. It
can be used in grinding and polishing fixtures for semiconductor wafer
substrates, aluminum-based hard disk substrates, glass-ceramics and other
materials. Because of the high strength of the material but the soft texture
and certain elasticity, it will not affect the sidewall of the workpiece and
cause scratches during the grinding and polishing process. The standard
material thickness is 0.40, 0.45, 0.53, 0.60, 0.70, 0.80, 1mm. It can
correspond to different processed products and process the corresponding jigs.
Other thickness products can also be customized according to customer
requirements.
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