Shenzhen Yuewen Technology Co., Ltd. is located in the
Silicon Valley Power Auto Electronics Pioneer Park in Longhua District,
Shenzhen. It is a professional company engaged in the research and development
of low carbon consumables in the field of grinding and polishing. The company´s
consumables have the advantages of greatly improving the polishing and
polishing efficiency, reducing the consumption of consumables, and the high
cost performance of consumables. It is the best choice for the application
environment of the consumables in the field of grinding and polishing.
The company´s main products are grinding stone (sponge
grinding wheel), compound boron nitride grinding disc, diamond grinding disc,
centerless grinding wheel and other various materials of grinding consumables,
particle size from C80# to C4000# and other series of products, able to meet
the grinding Various processes which required for polishing, and other
specifications can be customized according to customer requirements. Our
company´s various types of grinding stones are exclusively developed and
produced in China, which can completely replace imported similar products,
breaking the domestic monopoly of such consumables, and reducing the cost of
customers. Our company’s also offers high-quality single-sided grinding and
polishing machine accessories, such as ring gear, sun gear, star wheel, repair wheel,
grinding and polishing disc.
Our company’s policy adheres to the corporate vision of
“people-oriented, environmentally friendly, and endless customer satisfaction”
and continuously develops and produces new products. The products are mainly
sold to the Pearl River Delta, the Yangtze River Delta and other regions, and
exported to the United States, Japan, South Korea, Singapore, Vietnam, Malaysia
and other countries. Products are mainly used in sapphire substrate, computer
hard disk substrate, hard plastic, titanium alloy, aluminum alloy, iron alloy,
tool steel, bearing steel, stainless steel and other metal parts as well as
blue glass optical parts, various semiconductor materials, etc. Grinding and
polishing.
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Ultrasonic cleaning
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Grinding, polishing spot
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